Low void solder paste 'NP303-CQV-1K'
Achieving an ultra-low void of 5% or less!
The "NP303-CQV-1K" is a solder paste that achieves ultra-low voiding compared to conventional pastes by significantly enhancing the fluidity of the flux. It is compatible with a variety of components and atmospheric reflow. Please feel free to contact us if you have any requests. 【Basic Characteristics】 ■Solder Composition: Sn-3.0Ag-0.5Cu ■Melting Point (°C): 217–219 ■Halide Content (wt%): 0.06±0.02 ■Powder Type: Type 4 *For more details, please download the PDF or contact us.
- Company：ニホンゲンマ
- Price：Other
